Lam Research
Speed
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam Research SPEED product family is a series of High-Density Plasma Chemical Vapor Deposition (HDP-CVD) systems. The SPEED systems are designed for high-quality dielectric gapfill with industry-leading throughput and reliability. The product family includes the SPEED NExT and SPEED Max variants.[1]
What it is
The Lam Research Speed product family is a set of high-density plasma chemical vapor deposition tools.[1]
How it works
The SPEED family supports gapfill processes by depositing insulation layers between conductive and active areas while also using in-situ etching to shape the deposited film profile.[1]
Applications
The SPEED family is used for shallow trench isolation, pre-metal dielectrics, inter-layer dielectrics, inter-metal dielectrics, and passivation layers.[1]
What do the numbers mean?
Wafer handling1
Gas & chemistry1
Vintage & configurations
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- TypeHigh-Density Plasma Chemical Vapor Deposition (HDP-CVD)[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Not publicly documented
The following facts about the Speed are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the Speed are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Speed are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Speed are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Speed are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Speed is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]lamresearch.com — lamresearch.comlamresearch.com
- [2]Equipment inventory listing
Last updated Sep 29, 2026.