Lam Research

The SP 203 tool uses Bernoulli handling and a pinless chuck to support the wafer during processing, enabling non-contact or minimal-contact wafer transport. The machine's electrical specification is 200-208 V, 50/60 Hz, three-phase, with a current rating of 50.0 A. Exhaust is directed upward, and the tool contains three chemistry cabinets: two cabinets each have a main tank and buffer tank, while the third cabinet has a main tank.[1][2]
Documented failure modes, common issues, and field considerations.
The SEZ SP 203 is described as 1998 vintage.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| SEZ SP 203 Spin | — | — | Listed as a spin etcher. | waferpedia.com[3] |
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The SP 203 Spin is a spin etcher used for wet etching applications.[3][4]
The cleaning configuration requires 200-208 V, 50/60 Hz, three-phase power at 50.0 A, while the Spin version is specified as 400 VAC, 50 Hz, three-phase with a maximum current of 32 A.[1][2][3]
The SP 203 uses Bernoulli handling with a pinless chuck for 6-inch wafers.[1][2]
The following facts about the SEZ SP 203 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the SEZ SP 203 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SEZ SP 203 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SEZ SP 203 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the SEZ SP 203 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No description of the SEZ SP 203 is on record.
Answerable by: an engineer who operated it or an OEM application specialist
Last updated Oct 4, 2026.
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