Lam Research
IPEC 472
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Lam / IPEC 472 is a CMP (chemical mechanical polisher / chemical mechanical planarization) system. The Lam / IPEC 472 is configured for 6-inch wafer processing. The Lam / IPEC 472 is also configured for 8-inch wafer processing.[1][2][3]
What it is
The Lam Research IPEC 472 is a chemical mechanical planarization (CMP) polisher.[1][2][3]
How it works
General reference — not yet source-verifiedIn a CMP tool, the wafer is mounted on a rotating carrier head and pressed face-down against a rotating polishing pad. Slurry, containing abrasive particles and reactive chemicals, is dispensed onto the pad. The combination of chemical attack and mechanical action removes material at a controlled rate.
Where it fits in the process flow
General reference — not yet source-verifiedCMP is used after deposition steps such as oxide deposition, metal deposition, or poly-silicon deposition to remove excess material and create a flat surface for subsequent lithography. In the semiconductor fabrication flow, CMP typically follows a deposition or etching step and precedes photolithography.
Applications
General reference — not yet source-verifiedThe IPEC 472 is used for planarizing interlayer dielectrics, shallow trench isolation structures, and metal layers such as tungsten and copper.
What do the numbers mean?
Wafer handling3
Gas & chemistry2
Configuration & options4
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Mirra 3400— Same function class: CMP, nullCompare in depthsource[1]
- SCREEN AS 2000— Same function class: CMP, nullCompare in depthsource[1]
- Applied Materials Mirra Mesa— Same function class: CMP, nullCompare in depthsource[1]
- Strasbaugh 6 DF DC 1— Same function class: CMP, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the IPEC 472 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IPEC 472 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IPEC 472 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IPEC 472 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IPEC 472 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IPEC 472 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]Equipment inventory listing
Last updated Oct 10, 2026.
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The Strasbaugh 6 DF DC 1 is a refurbished single-station CMP (chemical mechanical polisher) with a 24-inch capacity overarm spindle polisher.
The SCREEN / DNS AS 2000 is a CMP (Chemical Mechanical Polisher) for 8-inch wafers.
The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.
Applied Materials Mirra Mesa is a CMP (Chemical Mechanical Polisher) with a 4-head, 3-platen polisher system module.
