Lam Research
Concept Two Triple Speed
The Lam Research Concept Two Triple Speed is a PECVD system for 8-inch wafers. The Lam Research Concept Two Triple Speed uses MKS pressure control and runs Speed Next 5.502 B22 software.[1][2]
Wafer size
Entegris FA 200-85 MT 7902 Wafer Cassette
Vacuum
MKS[1]
What it is
General reference — not yet source-verifiedPECVD systems use plasma to enhance chemical reactions at lower temperatures than thermal CVD, enabling deposition of dielectric and insulating films with controlled properties. The Concept Two Triple Speed name likely indicates multiple deposition stations or a high-throughput configuration, typical of cluster-tool architectures in semiconductor manufacturing.
How it works
General reference — not yet source-verifiedIn plasma-enhanced chemical vapor deposition, the wafer is placed on a heated pedestal while process gases flow through the chamber. The RF plasma breaks the gas molecules into reactive species that chemisorb on the wafer surface, forming a solid film. The pulsed or multi-station nature of the Triple Speed design may allow sequential deposition steps or higher throughput by cycling wafers through multiple process stations.
What do the numbers mean?
Vacuum & pumping1
Wafer handling6
Control & software2
Dimensions & facilities1
Configuration & options13
- DLCM[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Pressure ControlMKS[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Concept Two Triple Speed are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept Two Triple Speed are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept Two Triple Speed are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept Two Triple Speed are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept Two Triple Speed are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept Two Triple Speed is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Concept Two Triple Speed — Lam Research | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [3]Lam Research Concept Two Triple Speed family | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 22, 2026.
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