Kulicke & Soffa
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The Kulicke & Soffa 982-6 is a wafer dicing saw used in semiconductor manufacturing to singulate individual die from a processed wafer.
A wafer dicing saw uses a high-speed rotating diamond-impregnated blade to cut along the scribe lines of a wafer, separating it into individual chips.
The blade is mounted on an air-bearing spindle and is cooled by deionized water to prevent thermal damage and to flush away debris.
Dicing saws are used in the back-end assembly process, after wafer fabrication and electrical test, to separate the wafer into individual die.
Singulation is followed by die attach, wire bonding or flip-chip bonding, and encapsulation.
Wafer dicing saws are used to cut silicon wafers as well as wafers made from compound semiconductors such as gallium arsenide, silicon carbide, and other materials used in microelectronics and optoelectronics.
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The following facts about the 982-6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 982-6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 982-6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 982-6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 982-6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 982-6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 23, 2026.
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