Kulicke & Soffa
7500 Wafer
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Kulicke & Soffa 7500 Wafer is a wafer dicing saw for precision cutting. The Kulicke & Soffa 7500 Wafer is categorized under Dicing & Grinding.[1][2][3][4]
What it is
General reference — not yet source-verifiedWafer dicing saws are semiconductor back-end tools used to separate individual integrated circuit dies from a processed wafer. The saw mounts the wafer on adhesive tape and cuts along predefined scribe streets with a rotating diamond blade, then expands the tape to space the dies for pick-and-place handling.
How it works
General reference — not yet source-verifiedWafer dicing saws operate by holding the wafer firmly on a vacuum chuck or adhesive film while a high-speed rotating blade, typically diamond-impregnated, advances along the wafer surface. The blade cuts through the wafer material along the kerf, separating the die. The process uses a water spray for cooling and debris removal. After cutting, the tape is expanded to increase die spacing.
Applications
General reference — not yet source-verifiedWafer dicing saws are used to singulate a wide variety of semiconductor devices, including memory, logic, analog, and power integrated circuits, as well as discrete components and sensors. The process is applicable to silicon, gallium arsenide, and other semiconductor materials.
What do the numbers mean?
Wafer handling1
Performance1
Configuration & options2
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Kulicke & Soffa 7500 Wafer?
The Kulicke & Soffa 7500 Wafer is a wafer dicing saw used for precision cutting.[4][2]
What category does the 7500 Wafer belong to?
The 7500 Wafer is categorized under Dicing & Grinding.[4]
Who manufactures the 7500 Wafer?
The 7500 Wafer is manufactured by Kulicke & Soffa.[4]
What is a wafer dicing saw used for?
A wafer dicing saw is a semiconductor back-end tool used to separate individual integrated circuit dies from a processed wafer.[4]
How does a wafer dicing saw operate?
A wafer dicing saw holds the wafer on a vacuum chuck or adhesive film while a high-speed rotating blade advances along the wafer to cut it.[4]
Not publicly documented
The following facts about the 7500 Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7500 Wafer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7500 Wafer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7500 Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7500 Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7500 Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]spwindustrial.com — spwindustrial.comspwindustrial.com
- [3]KULICKE & SOFFA 7500 WAFER DICING SYSTEM — liveauctionworld.comliveauctionworld.com
- [4]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Sep 30, 2026.
Compare with similar tools
View all →
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
General referenceThe Blanchard 18 D Surface is a vertical-spindle rotary-table surface grinding machine used to produce flat, parallel surfaces on metal workpieces.
The Blanchard 20 36 Surface is a surface grinder used in dicing and grinding applications.
