Waferpedia

KLA

UV 1250 SE Thin Film Thickness Measurement

KLA UV 1250 SE family
Research Quality: 40% complete
UV 1250 SE Thin Film Thickness Measurement — Inventory photo
Fig. 01UV 1250 SE Thin Film Thickness MeasurementInventory photo[1]

Where it fits in the process flow

The eight-inch wafer size and open cassette handling indicate a configuration intended for production wafer measurement rather than single-sample laboratory handling.[1][4]

Applications

The KLA UV 1250 SE Thin Film Thickness Measurement is used for thin-film thickness measurement on wafers.[4]

What do the numbers mean?

Wafer handling4

Wafer size
8 inch[1]
Accurate?
Open cassette
Open casette[4]
Accurate?
Wafer handling
Open cassette[4]
Accurate?
Description
wafer film measurement instrument; ellipsometer[4]
Accurate?

Control & software6

Windows NT Software Version 4.0.1381[1]
Accurate?
Summit Software Version 2.62.06[1]
Accurate?
Windows NT software version
4.0.1381[1]
Accurate?
Summit software version
2.62.06[1]
Accurate?
Software
Windows NT software version 4.0.1381; Summit software version 2.62.06[1]
Accurate?
Control software
Windows NT software version 4.0.1381; Summit software version 2.62.06[1]
Accurate?

Configuration & options10

Open casette[1]
Accurate?
Tester Firmware Version 3.1.0[1]
Accurate?
KLA PN
28-0144 has been removed[2]
Accurate?
KLA PN
PCB 36-0133 Rev A has been removed[2]
Accurate?
KLA PN
PCA 54-0150 Rev J0 has been removed[2]
Accurate?
Make
KLA[3]
Accurate?
Model
UV 1250 SE[3]
Accurate?
Tester firmware version
3.1.0[1]
Accurate?
Maker
KLA[3]
Accurate?
Tester firmware
3.1.0[1]
Accurate?
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What software and firmware versions does the KLA UV 1250 SE use?

The system runs Windows NT software version 4.0.1381, Summit software version 2.62.06, and tester firmware version 3.1.0.[4]

What is the wafer handling configuration of the KLA UV 1250 SE?

The system uses an open cassette configuration for wafer handling.[4]

Not publicly documented

The following facts about the UV 1250 SE Thin Film Thickness Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UV 1250 SE Thin Film Thickness Measurement are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the UV 1250 SE Thin Film Thickness Measurement are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UV 1250 SE Thin Film Thickness Measurement are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UV 1250 SE Thin Film Thickness Measurement are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UV 1250 SE Thin Film Thickness Measurement is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
  4. [4]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 12, 2026.

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