GCA
AS200
Plate 01How to Properly Install the AS200 Drill Stand
AGP Power ToolsWatch on YouTubePlate 02AS-200 Automated Packaging Scale
Glenn FarkasWatch on YouTubePlate 03Caixas do gradiente as 200 abertas.. troca de falantes✌👏💪
Jucelio Santos Watch on YouTube
What it is
The GCA AS200 is an i-line wafer stepper used for photolithography.[1][2][4]
The GCA AS200 is a 5X reduction wafer exposure tool designed for wafers up to 200 mm. The GCA AS200 uses automated wafer loading and alignment, automated reticle loading and alignment, and manual operation is also possible.[1]
How it works
The GCA AS200 uses a Tropel i-line lens with 0.45 numerical aperture and 15 mm exposure field. The GCA AS200 uses broadband light for focus sensing, local alignment for overlay, automatic calibration, and compensation for lens heating and barometric shifts.[1]
The GCA AS200 supports annular and quadrupole illumination. The GCA AS200 includes a reticle management system for up to 10 reticles and interchangeable hand-held wafer chucks.[1]
Applications
The GCA AS200 is used for i-line photolithography on photoresist-coated wafers.[1]
- Photolithography
- Wafer exposure
What do the numbers mean?
Wafer handling9
- Automation
- All operations are automated, including wafer loading, aligning, reticle loading and aligning[1]
Optics & imaging14
Performance4
Configuration & options7
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASML PAS 5500— Same function class: Lithography, 200mmCompare in depthsource[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What reduction ratio does the GCA AS200 use?
The GCA AS200 is a 5X reduction wafer exposure tool.[1]
Not publicly documented
The following facts about the AS200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AS200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AS200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AS200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AS200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AS200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [2]cnfusers.cornell.edu — cnfusers.cornell.educnfusers.cornell.edu
- [3]nist.govnist.gov
- [4]https://www.cnfusers.cornell.edu/sites/default/files/Equipment-Resources/General%20Information%20Sheets_2.pdf — cnfusers.cornell.educnfusers.cornell.edu
Last updated Oct 3, 2026.
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The SUSS MicroTec MA200 Gen3 is a fully automated mask aligner for high-volume lithography on wafers and square substrates up to 200 mm.
