Disco
DTG 8460 Wafer Backside
What it is
General reference — not yet source-verifiedThe Disco DTG 8460 Wafer Backside is a dicing and grinding machine for wafer backside processing.
How it works
Where it fits in the process flow
General reference — not yet source-verifiedWafer backside grinding belongs in back-end or post-front-end wafer processing, where wafer thickness control and backside preparation support later dicing and assembly operations.
Applications
General reference — not yet source-verifiedWafer backside grinding is used in semiconductor manufacturing for wafer thinning and backside preparation before downstream singulation and packaging.
What do the numbers mean?
Wafer handling6
- Robot picker for 12", and 8" is possible[1]
Dimensions & facilities2
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the DTG 8460 Wafer Backside are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DTG 8460 Wafer Backside are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DTG 8460 Wafer Backside are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DTG 8460 Wafer Backside are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DTG 8460 Wafer Backside are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DTG 8460 Wafer Backside is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]DTG 8460 Wafer Backside — Disco | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 4, 2026.
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