Disco
DFD 6360 Automatic Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Disco DFD 6360 is an automatic dicing saw. Some Disco DFD 6360 units are configured for 3-phase power and 50/60 Hz operation.[1][2][3]
What it is
How it works
General reference — not yet source-verifiedAutomatic dicing saws use a rotating, high-speed blade mounted on a precision spindle to cut along predefined streets on a semiconductor wafer. The blade is typically composed of diamond grit embedded in a metal or resin bond. During cutting, a stream of deionized water cools the blade and flushes away debris. The wafer is mounted on dicing tape affixed to a frame, and the saw aligns to fiducial marks or patterns using a vision system before cutting. Modern saws can perform multiple passes, adjusting blade height and speed for different material layers.
Where it fits in the process flow
General reference — not yet source-verifiedDicing saws are used in the back-end semiconductor manufacturing process after wafer thinning and before die attach. The singulated die are then picked from the dicing tape for subsequent packaging steps such as die bonding, wire bonding, and encapsulation. In some flows, dicing follows passivation or redistribution layer (RDL) formation but always precedes final packaging.
What do the numbers mean?
Power & electrical4
- 50/60 Hz[3]
Configuration & options1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6360 Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6360 Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6360 Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6360 Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6360 Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6360 Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
- [7]Inventory photo
Last updated Oct 1, 2026.
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