Canon
The Canon FPA 3000 EX 5 is a fine pattern aligner for semiconductor lithography. The Canon FPA 3000 EX 5 is configured with a Cymer excimer laser (ELS 5310 or ELS 5300 B) and optionally a Rasco TWB-CD-110 Compact Chamber.[1][2][3][4]

A mask aligner holds a photomask and a substrate in close alignment so optical exposure transfers the mask pattern onto a light-sensitive film on the substrate.
A mask aligner sits in the lithography portion of semiconductor processing, after film preparation and before etch, implantation, or other pattern transfer steps.
A fine pattern aligner is used for photolithographic patterning in semiconductor fabrication.
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The following facts about the FPA 3000 EX 5 Fine Pattern are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the FPA 3000 EX 5 Fine Pattern are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FPA 3000 EX 5 Fine Pattern are not on record.
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No publicly documented failure modes or field errata for the FPA 3000 EX 5 Fine Pattern are on record.
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The process node or technology generation of the FPA 3000 EX 5 Fine Pattern is not on record.
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No publicly documented compatible parts, consumables, or accessories for the FPA 3000 EX 5 Fine Pattern are on record.
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Last updated Oct 3, 2026.
Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.