Axcelis

GSD 200 E 2 Ion

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The Axcelis GSD 200 E 2 Ion is an ion implanter. The Axcelis GSD 200 E 2 Ion is configured for 6 inch wafers. The Axcelis GSD 200 E 2 Ion includes high-current GSD-200EE configuration with 4-cassette capability.^[1]^[2]

GSD 200 E 2 Ion — Inventory photo — Fig. 01GSD 200 E 2 IonInventory photo^[1]

Vacuum

Beamline and Source Pumps^[1]

Gas delivery

MFC Type and Model^[1]

What it is

The Axcelis GSD 200 E 2 Ion is an ion implanter used in semiconductor fabrication.^[1]^[2]

The GSD 200 E 2 Ion is an Axcelis GSD 200 family tool.^[2]

How it works

The Axcelis GSD 200 E 2 Ion includes automated beam tuning and set-up with Eaton Autotune, a GEM/SECS interface, and an enhanced low-energy beamline.^[1]^[2]

Where it fits in the process flow

The Axcelis GSD 200 E 2 Ion supports wafer handling with 4-cassette capability and automatic flat or notch alignment with a buffer cassette.^[1]^[2]

Applications

The Axcelis GSD 200 E 2 Ion is configured as a high-current tool with a single-stage extraction of 90 keV and an energy range of 90 keV.^[1]^[2]

What do the numbers mean?

Vacuum & pumping7

Beamline and Source Pumps^[1]
Source Turbo Pump (P1): STP H2000C^[1]
Beam Line Cryo Pump (P3): CTI Onboard 10^[1]
End Station Cryo Pump (P2): CTI Onboard 8^[1]
Beamline and source pumps: Beamline and Source Pumps^[2]
Cryo Compressors: CTI 9600 (1)^[1]
Beamline and source pumps: Present^[1]

Wafer handling6

4-Cassette Capability^[1]; Automatic Flat or Notch Alignment Capability w/buffer cassette^[1]
Wafer size: 6 inch^[1]
Cassette capability: 4-cassette capability^[1]
Cassette capability: 4-cassette^[1]
Wafer alignment: Automatic Flat or Notch Alignment Capability w/buffer cassette^[1]

Gas & chemistry5

Gas Type: MFC Type and Model^[1]
Gas type - Ar MFC: UNIT 1662 10SCCM - SDS^[1]
Gas type - BF3 MFC: UNIT 1662 10SCCM - SDS^[1]
Gas type - AsH3 MFC: UNIT 1662 10SCCM - SDS^[1]
Gas type - PH3 MFC: UNIT 1660 10SCCM - SDS^[1]

Control & software5

Software Version 6.12.3^[1]; GEM/SECS Interface^[1]
Software version: 6.12.3^[1]
GEM/SECS interface: Present^[1]
Interface: GEM/SECS^[1]

Dimensions & facilities1

External Facilities Connections: Ar N2^[1]

Configuration & options32

High Current: GSD-200EE^[1]; Automated Beam tuning and Set-Up w/Eaton Autotune^[1]
Ion Source Type: ELS^[1]
Source Material Type: Moly^[1]; Signal Tower^[1]; Flag Faraday Injector^[1]; Direct Rotory Drive^[1]; Enhanced Low Energy Beamline^[1]; Process Disk w/Active Cooling & Chiller^[1]
Single Stage Extraction: 90keV^[1]
Beamline Version: Standard^[1]; Block Upgrade^[1]
Manufacturer: Axcelis^[1]
Model: GSD 200 E 2^[1]
Category: Ion Implantation^[2]; High Current GSD-200EE^[2]
Automated beam tuning and set-up: w/Eaton Autotune^[1]
Energy range: 90KeV^[1]
Ar: UNIT 1662 10SCCM - SDS^[1]
BF3: UNIT 1662 10SCCM - SDS^[1]
AsH3: UNIT 1662 10SCCM - SDS^[1]
PH3: UNIT 1660 10SCCM - SDS^[1]
Remote Disk Chiller: SMC-HRS050^[1]
Automated beam tuning and set-up: Eaton Autotune^[1]
Signal tower: Present^[1]
Injector: Flag Faraday Injector^[1]
Drive: Direct Rotory Drive^[1]
Beamline: Enhanced Low Energy Beamline^[1]
Process disk: Process Disk w/Active Cooling & Chiller^[1]
Extraction: Single Stage Extraction: 90keV^[1]
Block upgrade: Present^[1]
Family: GSD 200 family^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

ConfigurationBeamline and Source Pumps^[1]
Source Turbo Pump (P1)STP H2000C^[1]
Beam Line Cryo Pump (P3)CTI Onboard 10^[1]
End Station Cryo Pump (P2)CTI Onboard 8^[1]
Beamline and source pumpsBeamline and Source Pumps^[2]
Gas TypeMFC Type and Model^[1]
Cryo CompressorsCTI 9600 (1)^[1]
Beamline and source pumpsPresent^[1]
Gas type - Ar MFCUNIT 1662 10SCCM - SDS^[1]
Gas type - BF3 MFCUNIT 1662 10SCCM - SDS^[1]
Gas type - AsH3 MFCUNIT 1662 10SCCM - SDS^[1]
Gas type - PH3 MFCUNIT 1660 10SCCM - SDS^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Axcelis GSD 200 E 2 Ion support?

The Axcelis GSD 200 E 2 Ion is configured for 6 inch wafers.^[2]^[1]

What cassette capacity does the Axcelis GSD 200 E 2 Ion have?

The Axcelis GSD 200 E 2 Ion includes 4-cassette capability.^[2]^[1]

What beam energy is specified for the Axcelis GSD 200 E 2 Ion?

The Axcelis GSD 200 E 2 Ion is specified with a single-stage extraction of 90 keV and an energy range of 90 keV.^[2]^[1]

What control and interface features are included on the Axcelis GSD 200 E 2 Ion?

The Axcelis GSD 200 E 2 Ion includes automated beam tuning and set-up with Eaton Autotune and a GEM/SECS interface.^[2]^[1]

Not publicly documented

The following facts about the GSD 200 E 2 Ion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the GSD 200 E 2 Ion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the GSD 200 E 2 Ion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the GSD 200 E 2 Ion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the GSD 200 E 2 Ion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the GSD 200 E 2 Ion is not on record.
Answerable by: an OEM datasheet or a fab qualification report