Manufacturer
CEE
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22 entries
- 100 CB SpinCEE
The CEE 100 CB Spin is a spin coater from the CEE 100 family.
CategoryDeposition - 200CBXCEE
The CEE 200CBX is a precision coat-bake system described as a track-quality spin coater with a high-uniformity bake plate.
Categoryspin coaterWafer200mm - 200XDCEE
The CEE 200XD is a develop spinner used in cleanroom lithography workflows.
CategoryDevelop spinnerWaferup to 6 in wafers - 100 Spinner PartsCEE
- 100 SpinnerCEE
The CEE 100 Spinner is a programmable spin coater for applying uniform films to substrates up to 6 inches in diameter.
- 1000 Hot PlateCEE
The CEE 1000 Hot Plate is a thermal processing tool for 4-inch wafers.
CategoryThermal / Diffusion - 1100 FX Hot PlateCEE
The CEE 1100 FX Hot Plate is a hot plate with a maximum bake temperature of 300 degrees C, a substrate size range of 150 to 300 mm, and 240V 1Ph 60Hz power.
CategoryThermal / Diffusion - Apogee 450 SpinCEE
The CEE Apogee 450 Spin is a spin coater for large substrates up to 450 mm round and 14" x 14" square. The CEE Apogee 450 Spin is available in benchtop and X-Pro workstation configurations.
- 300 Bake PlateCEE
The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.
CategoryThermal / DiffusionWafer300mm - 100 CB Spin Coater Hot PlateCEE
The CEE 100 CB is a spin coater/hot plate with a flow controller.
- 200 Bake PlateCEE
The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.
CategoryThermal / DiffusionWafer200mm - 1300 X Hot PlateCEE
The CEE 1300 X Hot Plate is a hot plate for 3, 4, 5, 6, and 8 inch wafers with vacuum and exhaust, programmable bake processing, lift pin, and contact, vacuum contact, nitrogen purge, and proximity modes.
- 1000 SpinCEE
- 100 SpinCEE
The CEE 100 is a spin coater with a listed power specification of 115 volts and 800 watts.
CategoryResist Processing - SpinCEE
The CEE Spin is a photoresist spinner. The CEE Spin applies coatings to substrates up to 200mm round or 7 in. square and spins at speeds up to 6000 rpm.
- 100CBCEE
The CEE 100CB is a spinner/hotplate for handling substrates from 1 cm² to 4-inch wafers and for use with standard positive photoresists only.
CategorySpinner/HotplateWafer4" - 100CEE
The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.
CategoryLithographyWafer6" - 300 X SpinCEE
The CEE 300 X Spin is a spin coater designed for 300 mm silicon wafers.
- 1100 Hot PlateCEE
The CEE 1100 Hot Plate is a hot plate identified with 115V and 1725 watts.
CategoryThermal / Diffusion - 450 SpinCEE
The CEE 450 Spin Coater is a spin coater that handles up to 450mm round or 14"x14" square substrates and uses internal OS software.
CategoryDeposition - 200 SpinCEE
- Apogee SpinCEE
