YES
The YES-58TASM is a Vapor Prime, Image Reversal, and Silylation system. The YES-58TASM supports Vapor Prime and Image Reversal on up to 8 cassettes of 5- or 6-inch wafers or 12 cassettes of4-inch wafers. The YES-58TASM supports Silylation on up to 4 cassettes of5- or6-inch wafers or6 cassettes of4-inch wafers.[1]
Wafer size
4-inch, 5-inch, 6-inch
Performance
2 full loads/hr[1]
The YES 58TASM is a semiconductor process system used for vapor prime, image reversal, and silylation. The YES 58TASM belongs to the product family of vacuum bake and vapor prime systems from Yield Engineering Systems. The YES 58TASM performs vapor prime and image reversal at the listed cassette capacities, and performs silylation on 4 cassettes of 5 or 6-inch wafers or 6 cassettes of 4-inch wafers.[1]
Vacuum vapor prime systems operate under vacuum, heating the wafer and introducing an adhesion-promoting chemical vapor that reacts with the wafer surface. The vapor prime process typically uses hexamethyldisilazane (HMDS) to make the wafer surface hydrophobic and improve photoresist adhesion.
Image reversal processing converts a positive photoresist pattern into a negative tone through a controlled post-exposure treatment. Silylation treats the wafer surface with a silicon-containing chemistry to alter its properties for etching or lithography.
Vapor prime is performed before photoresist coating to enhance resist adhesion to the wafer surface. Image reversal is used in lithography to obtain negative-tone resist patterns from positive-tone resists. Silylation is applied after certain lithography steps to prepare the surface for subsequent dry etching.
Image reversal processes support lithography schemes requiring negative-tone patterns. Silylation processes support etch and lithography steps that depend on a modified surface chemistry.
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The YES 58TASM supports vapor prime, image reversal, and silylation.[1]
Silylation is performed on 4 cassettes of 5 or 6-inch wafers or 6 cassettes of 4-inch wafers.[1]
Image reversal is performed on 4 cassettes of 5 or 6-inch wafers or 6 cassettes of 4-inch wafers.[1]
Yield Engineering Systems (YES) manufactures the YES 58TASM.[1]
The following facts about the 58TASM are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 58TASM are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 58TASM are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 58TASM are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 58TASM are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 58TASM is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 22, 2026.