West Bond
wirebond-R1
What it is
The West Bond wirebond-R1 is a manual wirebonder used for making electrical contacts between semiconductor dies and packages. The equipment is a West-Bond Inc. model 7476E.[2]
How it works
The West Bond wirebond-R1 makes electrical interconnects by wirebonding between an integrated circuit die and an integrated circuit package. The tool supports standard 45 degree wedge bonding and 90 degree wedge bonding for deep access.[2]
The West Bond wirebond-R1 is optimized for Au or Al wire with a nominal diameter of 25 μm. The tool is compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding, and it uses a 4 W 63 kHz ultrasonic transducer with manual control through an 8:1 reduction ratio micromanipulator arm.[2]
Where it fits in the process flow
General reference — not yet source-verifiedWirebonding follows processes that prepare the die and package for interconnect formation. The resulting bonds provide the electrical path between the integrated circuit and the external package interface.
Applications
The West Bond wirebond-R1 is used for electrical contact formation between semiconductor dies and packages. The tool supports wedge bonding for standard access and deep access bonding geometries.[2]
The West Bond wirebond-R1 is suited to wirebonding with gold or aluminum wire in integrated circuit packaging workflows. The tool is intended for room temperature thermosonic bonding with those wire materials and sizes.[2]
- Making electrical contacts between semiconductor dies and packages
- Making electrical interconnects between integrated circuit packages and integrated circuit dies
What do the numbers mean?
Power & electrical3
- Equipment description
- Manual wirebonding tool designed to make electrical interconnects between integrated circuit packages and integrated circuit dies[2]
Control & software2
Configuration & options8
- Wire compatibility
- Optimized for Au or Al wires with a 25 μm (0.001") diameter; compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding[2]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the West Bond wirebond-R1 used for?
The West Bond wirebond-R1 is used for making electrical contacts between semiconductor dies and packages.[2]
What model is the West Bond wirebond-R1?
The West Bond wirebond-R1 is a West-Bond Inc. model 7476E.[2]
What bonding configurations does the tool support?
The West Bond wirebond-R1 supports standard 45 degree wedge bonding and 90 degree wedge bonding for deep access.[2]
What wire materials and sizes are supported?
The West Bond wirebond-R1 is optimized for Au or Al wire with a nominal diameter of 25 μm. The tool is compatible with Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding.[2]
What manual control and ultrasonic features are specified?
The West Bond wirebond-R1 uses a 4 W 63 kHz ultrasonic transducer and manual control through an 8:1 reduction ratio micromanipulator arm.[2]
Not publicly documented
The following facts about the wirebond-R1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the wirebond-R1 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the wirebond-R1 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the wirebond-R1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the wirebond-R1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the wirebond-R1 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
- [2]uwaterloo.ca — uwaterloo.cauwaterloo.ca
- [3]RAC1 wirebonder: manual [WESTBOND-wirebond-R1] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca
Last updated Oct 4, 2026.
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