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West Bond

7416

Packaging & BondingWest Bond 7416 family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

West Bond7416
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What it is

The West Bond 7416 is a manual wire bonder used in semiconductor packaging to create electrical interconnections between a die and its package or substrate. The 7416A variant of this model is a thermocompression wedge wire bonder.[1]

How it works

General reference — not yet source-verified

Thermocompression bonding uses a combination of heat and pressure to join a wire to a bond pad. The bond head applies downward force while the substrate is heated, causing the wire to deform and form a metallurgical bond. A wedge tool feeds the wire at a fixed angle and produces wedge-shaped bonds at both ends of the wire loop.

The West Bond 7416 employs a wedge bonding technique, where the wire is threaded through a capillary or wedge tool. The bonder typically uses gold or aluminum wire and can be configured with different feed angles to accommodate varying package geometries. The process does not use ultrasonic energy unless specified, relying instead on thermocompression alone.

Where it fits in the process flow

General reference — not yet source-verified

In semiconductor assembly, wire bonders follow the die attach step and precede encapsulation. The die is first attached to the package or substrate, then the wire bonder connects the die's bond pads to the package leads. After wire bonding, the assembly is encapsulated for protection.

What do the numbers mean?

Configuration & options2

Equipment type
Wire bonder[1]
Accurate?
Model listing
West-Bond 7416[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 7416 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the 7416 are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7416 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 7416 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 7416 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 7416 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.com — semistarcorp.comsemistarcorp.com
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Last updated Oct 2, 2026.

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