Towa

FFT 1030 W

Packaging & Bonding Towa FFT 1030 family

Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Towa FFT 1030 W is a molding system used for semiconductor packaging. The Towa FFT 1030 W handles 8-inch wafers and was manufactured in 2010. The Towa FFT 1030 W requires AC 200V, 3 Phase power.^[1]

FFT 1030 W — Inventory photo — Fig. 01FFT 1030 WInventory photo^[1]

What it is

Towa FFT 1030 W is a molding system used in semiconductor packaging.^[1]

The FFT 1030 W molding system supports 8 inch wafer sizes.^[1]

How it works

General reference — not yet source-verified

Molding systems encapsulate semiconductor devices in a protective resin compound.

Where it fits in the process flow

General reference — not yet source-verified

In semiconductor packaging, a molding system such as the FFT 1030 W is used after die attach and wire bonding, before post-mold curing and singulation.

The FFT 1030 W is part of the transfer molding process in IC packaging assembly lines.

Applications

The system is designed for molding processes on standard 8 inch wafers.^[1]

What do the numbers mean?

Power & electrical1

Power: AC 200V, 3 Phase^[1]

Wafer handling1

Wafer size: 8 inch^[1]

Control & software2

With HDD and software^[1]
Includes: HDD and software^[1]

Configuration & options1

Vintage: 2010^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

PowerAC 200V, 3 Phase^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Towa FFT 1030 W support?

The Towa FFT 1030 W supports 8 inch wafers.^[1]

What type of equipment is the Towa FFT 1030 W?

The Towa FFT 1030 W is a molding system used in semiconductor packaging.^[1]

Not publicly documented

The following facts about the FFT 1030 W are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FFT 1030 W are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FFT 1030 W are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FFT 1030 W are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FFT 1030 W are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FFT 1030 W is not on record.
Answerable by: an OEM datasheet or a fab qualification report