Temescal
Plate 01Temescal FC-1800 video showing loadlock, top chamber, bottom chamber
Plate 02Temescal FC-1800
Plate 03Temescal FC-1800 Automatic Deposition Process Demo - Part 1
Plate 04Temescal FC-1800 E-Beam evaporator used semiconductor equipment
Plate 05Temescal FC-1800 Auto Vent
Plate 06Temescal FC-1800 Automatic Deposition Process Demo - Part 3
The FC-1800 uses an electron beam power supply model CV-14 with 14 kW and an electron beam source model STIH-270 with six crucible pockets, three of 15 cc and three of 7 cc. The system has an 18-inch diameter water-cooled stainless steel chamber. A low-volume load lock mounted on top of the chamber uses a gate valve and motorized linear motion assembly for substrate exchange. A 7.5-inch diameter water-cooled rotating substrate stage with a speed range of 5 to 100 RPM can hold one 6-inch wafer or small pieces. A CTI-8 cryo pump and a mechanical pump achieve a base pressure better than 1x10^-7 torr. Deposition is controlled by an Inficon IC-5 deposition controller. An electron gun shutter assembly interfaces with the deposition controller.[5]
The FC-1800 is used in research and development environments such as university nanofabrication facilities and solar cell research labs. The system accommodates substrates up to 156 mm for solar applications. The FC-1800 is configured for deposition of multiple films without breaking vacuum, using its six-pocket crucible system.[3][4][5]
Typical applications of e-beam evaporation include metallization for ohmic contacts and Schottky barriers, deposition of optically transparent conductive oxides, anti-reflective coatings, and thin-film resistors. The ability to deposit multiple layers without breaking vacuum makes such systems suitable for complex multilayer stacks.
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The FC-1800 has an 18-inch diameter water-cooled stainless steel chamber.[5]
The FC-1800 can achieve a base pressure better than 1x10^-7 torr.[5]
The electron beam source model STIH-270 has six pockets, three of 15 cc and three of 7 cc.[5]
HSP-20 planets for the FC-1800 can accommodate 2-inch, 3-inch, 100-mm, 125-mm, and 150-mm wafers with various capacities.[2]
The following facts about the FC-1800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC-1800 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC-1800 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC-1800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC-1800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC-1800 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 30, 2026.
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