TEGAL
The Tegal 415 is a plasma asher for semiconductor processing. The Tegal 415 features an aluminum chamber with internal dimensions of 6 in x 6 in x 10 in. The Tegal 415 can be equipped with an optional rebuilt direct drive pump prepared for Fomblin/Krytox.[1][2]
A plasma asher generates an oxygen plasma inside a vacuum chamber. The reactive oxygen species chemically react with organic photoresist, converting it into volatile byproducts such as carbon dioxide and water vapor, which are then evacuated from the chamber.
Plasma ashers are used in semiconductor fabrication after etching, ion implantation, or other processes that leave a photoresist layer. The ashing step removes the photoresist before subsequent cleaning, metrology, or further processing steps.
How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.
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The following facts about the 415 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 415 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 415 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 415 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 415 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 415 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 11, 2026.
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