SUSS MicroTec
Provisional entry — research in progress
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The ACS200 uses cassette-to-cassette substrate handling, spin coating, spray coating, hotplate baking, automated edge-bead removal, and backside rinse.[4]
The ACS200 includes separate coating and development stations, and the system can process coating and development flows in parallel under operator control.[6]
The ACS200 Gen3 is used for research and high-volume manufacturing.[3]
The ACS200 supports photoresist coating for optical pattern exposure and photoresist coating for mask production.[4]
Four ACS200 Gen3 automatic coater/developer machines are stated as installed in Russia in 2016.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| ACS200 Gen3 | — | — | Described as a 200mm automated coater & developer for 100 mm to 200 mm wafers. | suss.com[3] |
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It is a wafer-track system used as a resist coater and developer.[2]
The following facts about the ACS 200 Linear Wafer Tracks are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the ACS 200 Linear Wafer Tracks are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the ACS 200 Linear Wafer Tracks are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the ACS 200 Linear Wafer Tracks is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the ACS 200 Linear Wafer Tracks are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the ACS 200 Linear Wafer Tracks are on record.
Answerable by: university cleanroom staff or an OEM application specialist
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Last updated Oct 5, 2026.
The ABM-407B-2-S-CE-S293 is a robot.