SE 100 DUZ Horizontal Injection

Horizontal injection molding machines of this class are designed to encapsulate semiconductor devices by injecting molten thermosetting resin into a mold cavity under pressure. The machine carries out the molding cycle automatically, including clamping, injection, curing, and ejection of the molded package.

In a horizontal injection molding machine used for semiconductor encapsulation, plastic molding compound pellets are fed into a heated barrel, where they are melted and homogenized by a rotating screw. The screw then acts as a ram, forcing the melt through a nozzle and into a closed mold that holds the leadframe or substrate with attached die.

The mold is held at an elevated temperature to cure the resin through cross‑linking. After a dwell period, the mold opens and the encapsulated devices are ejected. The optional auto‑gate cutting mechanism removes the gate and runner material from the molded part as part of the process cycle.

Downstream processes after encapsulation include post‑cure, deflashing (if needed), plating, singulation by sawing or punching, and final test. The injection molding machine replaces older transfer‑press molding for higher precision and less waste of molding compound.

Horizontal injection molding machines of this type are used to produce plastic‑encapsulated microelectronic packages such as small‑outline integrated circuits, quad flat no‑lead packages, and ball‑grid arrays. The process accommodates a range of thermosetting molding compounds including epoxy resins.

The machine is also suited for molding complex shapes with fine pitch. The integrated picker and conveyor systems allow automated handling of leadframe strips or JEDEC trays, supporting high‑volume production in an inline molding cell.