Strasbaugh
R 6 Y 2
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedChemical mechanical planarization polishers use a combination of chemical etching and mechanical abrasion to remove material and achieve a flat, smooth surface on a wafer.
How it works
General reference — not yet source-verifiedCMP polishers typically consist of a rotating platen covered with a polishing pad, a wafer carrier that holds the wafer against the pad, and a slurry distribution system that delivers a chemically active abrasive fluid to the interface.
The wafer carrier applies downward force and rotates, while the platen rotates counter-directionally, allowing the slurry to remove material uniformly across the wafer surface.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor fabrication, CMP is used to planarize layers after deposition steps such as chemical vapor deposition, physical vapor deposition, or electroplating.
After CMP, wafers typically undergo cleaning to remove slurry residues and are then inspected before subsequent lithography or deposition processes.
Applications
General reference — not yet source-verifiedApplications of CMP include shallow trench isolation (STI) planarization, interlayer dielectric (ILD) planarization, and metal CMP for tungsten or copper interconnect layers.
What do the numbers mean?
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Where are the manuals?
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Not publicly documented
Field notes
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Frequently asked questions
What is the full model designation of this equipment?
The full model is Strasbaugh R 6 Y 2 DC.[1]
Not publicly documented
The following facts about the R 6 Y 2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the R 6 Y 2 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the R 6 Y 2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the R 6 Y 2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the R 6 Y 2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the R 6 Y 2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Oct 2, 2026.
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