Waferpedia

Strasbaugh

6 DE DC 6

CMPStrasbaugh 6 DE DC 6 family
Research Quality: 50% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Strasbaugh 6 DE DC 6 is a six-spindle polisher with a 12-inch capacity.[1]

6 DE DC 6 — Inventory photo
Fig. 016 DE DC 6Inventory photo[2]

What it is

The Strasbaugh 6 DE DC 6 is a polisher used in semiconductor manufacturing.[2][3][1]

The Strasbaugh 6 DE-DC 6 Polisher is a six spindle machine with 12 inch capacity.[1]

How it works

General reference — not yet source-verified

A CMP polisher removes material from a wafer or other precision surface by combining a rotating platen, a polishing pad, slurry, and controlled downward force from the carrier or spindle assembly.

A multi spindle polisher can process multiple parts at once while maintaining pressure, rotation, and consumable interaction needed for planarization and surface finishing.

Where it fits in the process flow

General reference — not yet source-verified

A CMP polisher is used in wafer planarization and surface finishing steps after prior patterning or deposition operations.

The machine supports process integration where a flat, controlled surface is needed before later lithography, deposition, or metrology steps.

Applications

The Strasbaugh 6 DE DC 6 is used for chemical mechanical polishing in semiconductor manufacturing.[2][3][1]

What do the numbers mean?

Configuration & options7

Six Spindle[1]
Accurate?
12” capacity[1]
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Make
Strasbaugh[2]
Accurate?
Model
6 DE DC 6[3]
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Type
Polisher[2]
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Number of spindles
6[1]
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Capacity
12 inch[1]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
6 DE-DC 6——Spelling variant shown in source; source also states six spindle and 12" capacity.Equipment inventory listing[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What makes CMP different from ordinary polishing?General reference — not yet source-verified

CMP combines a chemically active slurry with controlled mechanical motion so material can be removed in a more uniform and processable way.

Not publicly documented

The following facts about the 6 DE DC 6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 6 DE DC 6 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 6 DE DC 6 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 6 DE DC 6 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 6 DE DC 6 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 6 DE DC 6 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
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Last updated Oct 3, 2026.

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