Signatone
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The Signatone CM-210 is a 200mm high precision manual probe system. The CM-210 supports DC, CV/IV, pulsed-IV measurements, high power applications up to 12kV/600A, and RF applications up to 110GHz with 2 and 4 port setups.[1]
The Signatone CM 210 is a manual probe station, belonging to the class of analytical test equipment used in semiconductor development and failure analysis. Probe stations allow electrical contact to be made to devices on a semiconductor wafer so that their DC, RF, or high-power characteristics can be measured.
The CM 210 positions a wafer on a 203 mm diameter chuck that can be moved in X, Y, and Z axes, and rotated in theta. The chuck XY stage provides 205 mm by 205 mm manual travel, with standard resolution of 14 μm and fine resolution of 1.5 μm per degree of knob rotation. The chuck Z stage is pneumatic, with 2.5 mm travel and a repeatability of ±1.0 μm.[1][2]
Microprobes are mounted on a platen above the chuck; the platen is made of nickel-plated steel or optional aluminum. The platen offers a continuous variable lift (CVL) of 0 to 3.175 mm, a fine lift adjustment of 38.1 mm, and a quick lift of 3.175 mm. Up to 10 DC/HV micropositioners, or a mix of RF and DC positioners, can be mounted magnetically or by bolt-down on the platen.[1][2]
The system has an ultra-stable 50 mm thick aluminum base. Contact repeatability by manual control is less than 1 μm. Optional accessories include an active vibration isolation table, a hot chuck system for temperature up to 300 °C, and a motorized or semi-automatic upgrade.[1][2][3]
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The CM 210 supports full or partial wafer probing on wafers up to 200 mm. The standard chuck is 203 mm in diameter.[1][2]
The CM 210 can be equipped with an optional hot chuck system that provides a temperature range from ambient up to 300 °C.[1][2]
The following facts about the CM 210 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CM 210 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CM 210 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CM 210 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CM 210 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CM 210 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 30, 2026.