Shinkawa
UTC 300 BI
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedWire bonders join a semiconductor die to package leads or substrate pads using fine metal wires. The Shinkawa UTC 300 BI likely employs either thermosonic ball bonding or ultrasonic wedge bonding, common techniques in the UTC series.
In thermosonic ball bonding, a capillary tool feeds a wire, forms a ball at its tip, and bonds it to the die pad using heat, pressure, and ultrasonic vibration. The wire is then looped to the package lead and a second bond completes the connection. Wedge bonding uses a wedge-shaped tool and cold ultrasonic energy, typically with aluminum wire.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonders like the Shinkawa UTC 300 BI operate in the packaging stage of semiconductor manufacturing. After wafer fabrication and dicing, each die is attached to a substrate or leadframe. Wire bonding then forms the electrical connections from the die pads to the package leads. Subsequent steps include encapsulation, molding, trim, and final test.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the UTC 300 BI are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the UTC 300 BI are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 300 BI are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 300 BI are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 300 BI are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 300 BI are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]UTC 300 BI — Shinkawa | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Sep 28, 2026.
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