Shinkawa
UTC 2000 Super
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedWire bonders typically use thermosonic or ultrasonic bonding. The equipment feeds wire through a capillary, applies heat and ultrasonic energy to bond the wire to the die pad and package lead. The bond head moves precisely to form loops of wire between bond points.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor packaging, wire bonding occurs after die attach and before encapsulation. The die is first attached to the package substrate, then wire bonder connects the die pads to the leadframe or substrate bond fingers. After wire bonding, the assembly is encapsulated in molding compound.
What do the numbers mean?
Configuration & options11
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the UTC 2000 Super are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 2000 Super are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 2000 Super are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 2000 Super are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 2000 Super are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UTC 2000 Super is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]asesemiconductor.com — asesemiconductor.comasesemiconductor.com
- [3]waferpedia.comwaferpedia.com
- [4]dynamicmos.com — dynamicmos.comdynamicmos.com
Last updated Oct 6, 2026.
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