Semitool
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The Semitool 270 S SRD is a spin rinse dryer. The Semitool 270 S is the model designation for this Semitool spin rinse dryer.[1][2][3][4]

During the rinse cycle, deionized water is dispensed onto the spinning wafer to remove any remaining chemical residues from the preceding wet process.
In the drying cycle, the wafer is spun at a high rotational speed; centrifugal force flings the water off the wafer surface, and a flow of heated nitrogen gas is typically introduced to promote evaporation and prevent watermarks.
Upstream steps include wet cleaning baths (such as RCA clean, piranha etch, or dilute HF treatments) or wet etch steps, after which the wafer must be rinsed and dried before proceeding to subsequent thermal, deposition, or lithography processes.
Downstream from the spin rinse dryer, the wafer moves to a dry environment for inspection, metrology, or the next process step, because any residual moisture can cause defects or process issues.
The machine is used for wafers processed in wet stations that require a clean, dry surface free of water spots and chemical residue before subsequent processing.
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The primary function is to rinse off chemical residues from wafers after wet processing and then dry them using high-speed centrifugal force and heated gas, leaving the surface clean and moisture-free.
Drying is achieved by spinning the wafers at high speeds to centrifugally remove bulk liquid, followed by a flow of heated nitrogen or filtered air that evaporates residual moisture. The combination ensures complete drying without leaving spots or streaks.
Common preceding steps include acid etching, alkaline cleaning, solvent rinses, and oxide stripping. The spin rinse dryer is used to remove the chemical bath residues and prepare the wafers for further processing.
Contamination control is maintained by using filtered air or inert gases, employing chemically resistant materials in the chamber, and often incorporating HEPA filtration. The closed-loop design minimizes exposure to ambient particulates and ensures the wafers remain in a clean environment throughout the cycle.
The following facts about the 270 S SRD are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 270 S SRD are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 270 S SRD are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 270 S SRD are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 270 S SRD are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 270 S SRD is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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