SCREEN
FC 821 L
Wafer size
Wafer Transfer Machine
Power
3 φ 200 V, 125 A[1]
Vacuum
Exhaust Box[1]
Gas delivery
Chemical Bath (2)[1]
What it is
General reference — not yet source-verifiedWet stations perform wet chemical processing of semiconductor wafers, including cleaning, etching, and rinsing steps.
How it works
General reference — not yet source-verifiedIn a typical wet station, wafers are loaded into cassettes and transferred by a robot through a sequence of chemical baths and rinse tanks. The station includes chemical supply systems, exhaust management, and concentration monitoring. Wafers are dried at the end of the process.
Applications
General reference — not yet source-verifiedApplications of wet stations include silicon cleaning, oxide etching, metal cleaning, and processes for specialized materials such as silicon-germanium. The equipment supports a range of wet chemical recipes.
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
- Exhaust Box[1]
Wafer handling2
- Carrier Transfer Robot[1]
Gas & chemistry2
Configuration & options9
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of chemicals are typically handled by these systems?General reference — not yet source-verified
Systems in this class are designed to accommodate a variety of process chemicals, including acids, bases, solvents, and surfactants. The selection depends on the contaminant to be removed and the chemical compatibility of the substrate material.
How are cross-contamination and carryover prevented between baths?General reference — not yet source-verified
Prevention is achieved through careful engineering: drip trays, air-knife or roll-off steps, cascading rinse tanks, and strict control of transfer speed and drainage. Some systems also employ dedicated rinsing stations after each chemical bath to minimize drag-out.
Can this class of machines process substrates other than silicon wafers?General reference — not yet source-verified
Yes. With appropriate fixtures, carriers, and process parameters, these stations can handle a range of materials such as glass, ceramics, compound semiconductors, and metals, as long as the chemicals and temperature ranges are compatible with the material properties.
What is the typical level of automation and how does it affect operation?General reference — not yet source-verified
Most modern systems are fully automated, using programmable logic to sequence immersions, heating, and rinsing. Automation ensures high repeatability, reduces operator exposure to chemicals, and allows the system to run unattended for extended periods, though routine monitoring and maintenance are still required.
How is chemical waste managed in these systems?General reference — not yet source-verified
Waste management is an integral part of the design. Spent process baths and rinse water are typically drained to a central waste collection system or treated on-site. Many systems incorporate features like recirculation with filtration to extend bath life and reduce effluent volume.
Not publicly documented
The following facts about the FC 821 L are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 821 L are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the FC 821 L are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the FC 821 L are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the FC 821 L are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the FC 821 L is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Equipment inventory listing
- [3]Equipment inventory listing
Last updated Sep 30, 2026.
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