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Plasma-Therm

790

DepositionPlasma-Therm 790 family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

Plasma-Therm790
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What is it?

Applications

Typical application areas include microelectromechanical systems (MEMS), photonics, solid-state lighting, and failure or yield analysis. The system is suitable for processing substrates for prototyping, pilot lines, and low-volume production.[2]

What do the numbers mean?

Gas & chemistry1

Category
Chemical Vapor Deposition (CVD)[1]
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Configuration & options5

Tool name
PECVD 1 (PlasmaTherm 790)[1]
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System type
open-load etch and deposition systems[2]
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Series reference
formerly Plasma-Therm 790+ series[2]
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Process type
PECVD[1]
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Archived series reference
formerly Plasma-Therm 790+ series open-load etch and deposition systems[2]
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Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
790+——Predecessor to Advanced Vacuum Vision 300 and 400 open-load etch and deposition systems.web.archive.org[2]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • CategoryChemical Vapor Deposition (CVD)[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the primary function of the Plasma-Therm 790?

The Plasma-Therm 790 is a PECVD system used for depositing thin films.[1]

Not publicly documented

The following facts about the 790 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 790 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 790 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 790 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 790 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 790 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]wiki.nanotech.ucsb.edu — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  2. [2]web.archive.org — web.archive.orgweb.archive.org
  3. [3]Tool List - UCSB Nanofab Wiki — wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu
  4. [4]Tool List - UCSB Nanofab Wiki — wiki.nanofab.ucsb.eduwiki.nanofab.ucsb.edu
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Last updated Sep 26, 2026.

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