Palomar
2470 V
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Palomar 2470 V is a wire bonder manufactured by Palomar.[1]
What it is
How it works
General reference — not yet source-verifiedWire bonders operate by feeding a fine wire through a capillary tool and bonding one end to a bond pad on the die, then routing the wire to a corresponding pad on the package or substrate and bonding the second end. The bond is typically formed using a combination of heat, pressure, and ultrasonic energy to create a metallurgical connection. The process can be thermosonic (using heat and ultrasonic energy) or thermocompression (using heat and pressure), depending on the specific wire material and application.
What do the numbers mean?
No specifications recorded yet
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Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What types of bonding processes can this class of machine support?General reference — not yet source-verified
Packaging and bonding machines in this class typically support processes such as eutectic die bonding, epoxy die bonding, and multiple wire bonding methods (ball bonding, wedge bonding). The specific capabilities may vary by model and configuration.
How does the machine handle alignment for precise placement?General reference — not yet source-verified
Alignment is achieved using vision systems that locate die and substrate fiducials or patterns. The machine then adjusts its XY stage and bond head to place the die or form the wire bond within required tolerances, often under a micron for high-precision applications.
How does this class of machine ensure bond quality and reliability?General reference — not yet source-verified
Bond quality is maintained through precise control of bonding parameters (force, temperature, ultrasonic power, time) and often includes in-situ monitoring (e.g., bond force feedback, piezoelectric sensors) and post-bond inspection. Many machines also offer process validation using pull or shear testing capabilities.
Not publicly documented
The following facts about the 2470 V are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 2470 V are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2470 V are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2470 V are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2470 V are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2470 V are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Equipment inventory listing
Last updated Oct 8, 2026.
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