Oxford Instruments
PlasmaPro NGP 1000
Wafer size
up to 450mm wafer size
Power
600W 13.56Mhz HF RF Generator[1]
Vacuum
Load Lock vacuum pump[1]
Gas delivery
Gas-Shock assisted Chamber Lift Mechanism[1]
What it is
The Oxford Instruments PlasmaPro NGP 1000 is a plasma-enhanced chemical vapor deposition system. The machine is a deposition tool configured for wafer processing up to 450 mm.[1][2]
The PlasmaPro NGP 1000 is a vacuum process tool with a load-locked chamber and an external gas box. The equipment includes system control hardware and process support hardware for plasma deposition operation.[1][2]
How it works
The PlasmaPro NGP 1000 uses a 600 W high-frequency generator at 13.56 MHz and a 600 W low-frequency generator at 100 kHz. The machine also uses an Adixen ADS602P dry pump for the process chamber and a separate load-lock pump.[1][2]
The PlasmaPro NGP 1000 includes a gas-shock assisted chamber lift mechanism and an X20 external gas box with up to 12 gas lines. The machine can be configured with He, CF4, N2, N2O, NH3, and SiH4-N2.[1][2]
Where it fits in the process flow
The PlasmaPro NGP 1000 sits in the deposition segment of wafer fabrication. The load-locked chamber supports wafer transfer into a controlled vacuum process environment before film deposition.[2]
The PlasmaPro NGP 1000 can be used with a chamber heating kit and is specified for operation up to 400 C. The machine also includes a 490 mm diameter aluminum lower electrode.[1][2]
Applications
What do the numbers mean?
Power & electrical8
- Dual Frequency RF with Pulsing for Film Stress Control[1]
Vacuum & pumping4
Wafer handling6
Gas & chemistry6
Control & software5
Configuration & options11
- 490mm Diameter Aluminum Lower Electrode[1]
- Up to 400*C[1]
- Chamber Heating Kit (Heats Chamber Sidewalls to Minimize Process Deposition)[1]
- Operations Manual and Documentation[1]
- Fully Refurbished to excellent condition[1]
- Chamber disassembled for refurbishment.[1]
- Chamber received full wet clean[1]
- Chamber Heating
- Chamber Heating Kit (Heats Chamber Sidewalls to Minimize Process Deposition)[1]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| PlasmaPro NGP1000 ICP 380 | — | 2013 | Etch version with ICP source (5kW, 2MHz RF), 3000W 13.56MHz RF for RIE, different turbo pump and dry pumps, different gas configuration (BCL3, N2, CL2, HBr, SF6, CF4, Ar, O2), mechanical wafer clamping, optical endpoint detector. | classoneequipment.com[3] |
| Oxford PlasmaPro NGP1000 ICP 380 | — | 2013 | Etch version with ICP source, 5kW 2MHz RF, 3000W 13.56MHz RF for RIE, different turbo pump and dry pumps, different gas configuration, mechanical wafer clamping, and optical endpoint detector. | classoneequipment.com[3] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationDual Frequency RF with Pulsing for Film Stress Control[1]
- Power600W 13.56Mhz HF RF Generator[1]
- Power600W 100khz LF RF Generator[1]
- ConfigurationGas-Shock assisted Chamber Lift Mechanism[1]
- ConfigurationAdixen ADS602P Dry Pump for Process Chamber[1]
- ConfigurationLoad Lock vacuum pump[1]
- ConfigurationX20 External Gas Box with up to 12 Gas Lines. Currently Configured for: He, CF4, N2, N20, NH3, SiH4-N2[1]
- Process TypePlasma-Enhanced Chemical Vapor Deposition (PECVD)[1]
- RF Power (HF)600W at 13.56MHz[1]
- RF Power (LF)600W at 100kHz[1]
- RF ConfigurationDual Frequency RF with Pulsing for Film Stress Control[1]
- Process PumpAdixen ADS602P Dry Pump[2]
- Load Lock PumpLoad Lock vacuum pump[2]
- Gas BoxX20 External Gas Box with up to 12 Gas Lines[1]
- Gas ConfigurationHe, CF4, N2, N20, NH3, SiH4-N2[1]
- Chamber LiftGas-Shock assisted Chamber Lift Mechanism[1]
- HF RF power600W at 13.56MHz[2]
- LF RF power600W at 100kHz[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the PlasmaPro NGP 1000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PlasmaPro NGP 1000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the PlasmaPro NGP 1000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PlasmaPro NGP 1000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PlasmaPro NGP 1000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the PlasmaPro NGP 1000 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]classoneequipment.com — classoneequipment.comclassoneequipment.com
Last updated Oct 7, 2026.
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