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Nordson

4600

Packaging & BondingNordson 4600 family
Research Quality: 50% complete

The Nordson 4600 is an automated bond tester. The Nordson 4600 automates wire pull, bond shear, and cold-bump pull testing for microelectronic and semiconductor devices. The Nordson 4600 is configured with an inc XY stage.[1]

4600 — Inventory photo
Fig. 014600Inventory photo[2]

What it is

The Nordson 4600 is an automated bond tester designed for the semiconductor and microelectronics industries.[3][2][1][4]

The machine is used to perform wire pull, bond shear, and cold-bump pull tests on microelectronic devices.[1]

How it works

The 4600 uses high-accuracy positioning stages with sub-micron resolution and repeatability to automate traditional manual bond testing processes.[1]

The system features multiple cameras for full-field-of-view and alignment, plus a fiducial alignment capability for automatic product alignment.[1]

Multi-function test cartridges configured with combinations of shear and pull cartridges carry out the mechanical testing; these cartridges include air-bearing technology for shear testing.[1]

The Paragon graphical user interface software provides automation-guided setup, step-and-repeat test patterns, and built-in checklists and help functions.[1]

Image capture after testing, including compound surface imaging through a Z-stack, supports failure mode analysis.[1]

Where it fits in the process flow

General reference — not yet source-verified

Bond testers are used in the back-end semiconductor assembly and packaging process to verify the mechanical integrity of wire bonds, solder bumps, and die attachments.

The Nordson 4600 sits after wire bonding, die attach, and flip-chip bumping operations, serving as a quality-assurance and process-characterization tool.

Applications

Automated wire pull testing, bond shear testing, and cold-bump pull testing are primary applications of the Nordson 4600.[1]

The system supports multiple test methods including wire pull, wire bond shear, passivation shear, die shear, tweezer pull, and hot bump pull.[1]

The 4600 handles semiconductor, automotive, aerospace, military, telecommunications, medical electronics, fibre optic, and other microelectronic device testing.[1]

The machine is compatible with wafer sizes from 2 inches to 8 inches.[2]

What do the numbers mean?

Power & electrical4

47-63 Hz[2]
Accurate?
90-264v[2]
Accurate?
Power / frequency
47-63 Hz[2]
Accurate?
Input voltage
90-264v[2]
Accurate?

Wafer handling1

Wafer sizes
2, 3, 4, 5, 6, 8 inch[2]
Accurate?

Configuration & options3

Inc XY Stage[3]
Accurate?
Phase
1 Phase[2]
Accurate?
Power
350w[2]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration47-63 Hz[2]
  • Configuration90-264v[2]
  • Power / frequency47-63 Hz[2]
  • Input voltage90-264v[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What test methods does the Nordson 4600 support?

The 4600 supports wire pull test, wire bond shear test, passivation shear test, die shear test, tweezer pull test, and hot bump pull test.[1]

What wafer sizes can the Nordson 4600 handle?

The 4600 handles wafer sizes from 2 inches to 8 inches.[2]

Does the Nordson 4600 include an XY stage?

Yes, the 4600 is available with an XY stage.[3][4]

What software does the Nordson 4600 use?

The 4600 uses the Paragon graphical user interface software for automation, programming, and reporting.[1]

Not publicly documented

The following facts about the 4600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4600 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 4600 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 4600 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 4600 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 4600 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]Automated Bond Tester Dage 4600 - Inseto UK — inseto.cominseto.com
  2. [2]Inventory photo
  3. [3]inventory listing
  4. [4]4600 — Nordson | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
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Last updated Oct 6, 2026.

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