Nordson
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The Nordson Dage 4000 Plus bond tester performs shear tests up to 200 kg, pull tests up to 100 kg, and push tests up to 50 kg. The Nordson Dage 4000 Plus is used for pull and shear testing of wafer interconnections, lead frames, hybrid microcircuits, and automotive electronic packages.[1]

The Nordson 4000 Plus is a bond test system used to evaluate the mechanical strength of interconnections in semiconductor packages and electronic assemblies.[2][1]
The system is capable of performing shear, pull, and push tests, covering a range of applications from wire bond testing to bump shear and micro-materials testing.[1]
Force application is monitored by a load cell, and the system records the force at which the bond fails, along with displacement data.
Bond testers are employed after wire bonding, flip-chip bonding, or tape automated bonding (TAB) processes to verify bond integrity as part of quality assurance.
Upstream process steps include die attach and wire bonding; downstream steps include final electrical test and encapsulation.
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The following facts about the 4000 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4000 Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4000 Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4000 Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4000 Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4000 Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 7, 2026.
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