Kulicke & Soffa
Rapid Automatic
The K&S Rapid Automatic Wire Bonder is an automatic wire bonding system. The K&S Rapid Automatic Wire Bonder operates on single-phase 50/60 Hz power.[1][2][3][4][5]
What it is
General reference — not yet source-verifiedAutomatic wire bonders are semiconductor packaging tools that use fine wire to electrically connect the bond pads on a die to the leads of a package or substrate.
How it works
General reference — not yet source-verifiedAutomatic wire bonders perform either ball bonding or wedge bonding. In ball bonding, a wire is fed through a capillary and a spark forms a ball that is pressed onto the bond pad using ultrasonic energy, heat, and force. The wire is then looped to the target lead, where a second bond is made, and the wire is cut. Wedge bonding uses a similar process but with a different tool and lower temperatures.
The K&S Rapid automates these steps with computer-controlled motion systems, pattern recognition for alignment, and real-time process monitoring to achieve high throughput and repeatable bond quality.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor packaging, wire bonding typically follows die attach and precedes encapsulation or molding. The die is mounted on a leadframe or substrate, and the wire bonder connects each die pad to the corresponding lead. After bonding, the assembly goes through encapsulation to protect the wires and die.
Applications
General reference — not yet source-verifiedWire bonding is used in a wide range of semiconductor devices, including integrated circuits, memory devices, power modules, LEDs, and discrete components. The K&S Rapid is designed for general-purpose automatic bonding of aluminum or gold wire.
The machine is applicable to both fine-pitch and standard-pitch bonding tasks, supporting various package types such as QFN, BGA, and leadframe-based packages.
What do the numbers mean?
Power & electrical4
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| K&S Rapid Automatic Wire Bonder | — | 2022–2022 | — | Equipment inventory listing[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the typical daily maintenance required for this machine class?General reference — not yet source-verified
Routine maintenance for wire bonders typically involves cleaning the capillary, changing worn bonding tools, replacing wire spools, and checking the ultrasonic transducer and bond head for wear. Calibration checks of the pattern recognition system and bond placement accuracy are also performed periodically to maintain process quality.
Can this machine class handle copper wire bonding?General reference — not yet source-verified
Yes, many modern automatic wire bonders are designed to support copper wire bonding, which requires careful control of bond parameters and an inert atmosphere, such as nitrogen, to prevent oxidation. Operators should verify that their specific machine configuration includes the necessary hardware and process kits.
What is the typical setup time for changing from one package type to another?General reference — not yet source-verified
Setup time varies, but machines in this class are designed for rapid changeover. Operators typically install a new bond program, change the capillary and wire, and load a new workholder or lead frame magazine. Advanced models may store multiple programs and provide automated changeover features to reduce downtime.
How is process quality typically monitored on such machines?General reference — not yet source-verified
Process quality is monitored through in-situ sensors that detect bond deformation, pull testing of sample wires, and electrical testing of bonded units. Many machines also record traceability data for each bond, enabling statistical process control and defect traceability.
Not publicly documented
The following facts about the Rapid Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rapid Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Rapid Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rapid Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rapid Automatic is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Rapid Automatic are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Equipment inventory listing
- [5]Equipment inventory listing
- [6]inventory listing
Last updated Sep 26, 2026.
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