Waferpedia

F&K Delvotec

G 5

Packaging & BondingF&K Delvotec G 5 family
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

G 5 — Inventory photo
Fig. 01G 5Inventory photo[1]

Power

100-120 / 200-240 V, 0.6 kVA[5]

Vacuum

Vacuum based[5]

What it is

The F&K Delvotec G 5 is a wire bonder used in semiconductor packaging and bonding. The G 5 62000 configuration runs with 25 µm wire and features a ball/wedge bondhead. The G 5 62000 has a 120 kHz transducer and supports 90-degree bonding. The machine is vacuum based and operates on 100-120 / 200-240 V with 0.6 kVA power consumption.[5][4]

What do the numbers mean?

Power & electrical3

Power
100-120 / 200-240 V, 0.6 kVA[5]
Accurate?
Phase
50/60 Hz, Phase 5, 2.5 A[5]
Accurate?
Transducer
120 kHz[5]
Accurate?

Vacuum & pumping1

Vacuum
Vacuum based[5]
Accurate?

Configuration & options11

45° or 90° Bondhead[4]
Accurate?
Refurbished[4]
Accurate?
Equipment type
Wire bonder[4]
Accurate?
Bondhead
45° or 90° bondhead[4]
Accurate?
Condition
Refurbished[4]
Accurate?
Vintage
2014[4]
Accurate?
Wire diameter
25 µm wire[5]
Accurate?
Bondhead type
Ball/wedge bondhead[5]
Accurate?
Gold Ball[5]
Accurate?
Minimum pad size
PCB 70 µm minimum pad size[5]
Accurate?
Angle
90 degrees[5]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Power100-120 / 200-240 V, 0.6 kVA[5]
  • Phase50/60 Hz, Phase 5, 2.5 A[5]
  • Transducer120 kHz[5]
  • VacuumVacuum based[5]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the G 5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the G 5 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the G 5 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the G 5 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the G 5 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the G 5 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
  4. [4]inventory listing
  5. [5]waferpedia.com — waferpedia.comwaferpedia.com
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Last updated Oct 10, 2026.

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