EV Group
301
The EVG 301 is a single wafer cleaning system for R&D applications. The EVG 301 features megasonic cleaning with a 1 MHz nozzle and spinner rotation up to 3000 rpm. The EVG 301 can be configured with a pre-bonding station and an IR-inspection module.[1][2]
What it is
The EVG 301 is a single-wafer megasonic cleaning system designed for wet processing in semiconductor fabrication.[2][1]
How it works
The EVG 301 uses an aqueous-based megasonic cleaning process employing deionized (DI) water.[2]
The system features a spinner that can rotate wafers up to 3000RPM.[2]
A megasonic nozzle operating at 1 MHz frequency delivers output power between 30 and 60W, with a DI-water flow rate up to 1.5 liters per minute.[2]
The EVG 301 includes an integrated direct bonding station and an IR-inspection module with a lamp and camera.[2]
The system is enclosed in a Class 1 mini-environment equipped with HEPA filters and an ionizer.[2]
Where it fits in the process flow
Applications
The EVG 301 is used for aqueous-based cleaning applications such as silicon direct bonding.[1]
The system supports solvent-based cleaning applications for post-debond cleans.[1]
Optional features include brush scrubbing for single-side cleaning and diluted chemical cleaning.[1]
- Megasonic wafer cleaning
- Pre-bonding
- IR inspection
What do the numbers mean?
Power & electrical5
Vacuum & pumping1
Wafer handling3
Gas & chemistry1
Optics & imaging3
Configuration & options20
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Lam Research SEZ SP 304— Same function class: Wet Processing / Clean, nullCompare in depthsource[4]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Megasonic nozzle frequency1 MHz[2]
- Megasonic nozzle frequency1 MHz (3 MHz option)[1]
- Cleaning systemAqueous-based (DI water) megasonic cleaning; solvent cleaning option[2]
- Megasonic nozzlefrequency 1 MHz, output 30–60 W[3]
- Power supplysingle‑phase 200 V, 50/60 Hz[3]
- Spinner chuckvacuum chuck (standard), edge handling chuck (option)[1]
- Megasonic area transducer frequency1 MHz (3 MHz option)[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the maximum rotation speed of the spinner?
The spinner can rotate up to 3000RPM.[2]
What frequency does the megasonic nozzle use?
The megasonic nozzle operates at 1 MHz frequency.[2]
What is the DI-water flow rate capability?
The DI-water flow rate is up to 1.5 liters per minute.[2]
Does the EVG 301 include an IR-inspection module?
Yes, the EVG 301 has an IR-inspection module with a lamp and camera.[2]
What cleaning media is standard for the system?
The standard cleaning media is deionized (DI) water.[1]
What wafer diameter range does the EVG 301 support?
The system supports wafer diameters of 100 mm to 300 mm, with 200 mm as standard.[1]
Not publicly documented
The following facts about the 301 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 301 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 301 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 301 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 301 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 301 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]epfl.ch — epfl.chepfl.ch
- [3]Inventory photo
- [4]fabsurplus.comfabsurplus.com
- [5]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
- [6]https://www.epfl.ch/research/facilities/cmi/wp-content/uploads/2024/10/EVG510_manual_2024.pdf — epfl.chepfl.ch
Last updated Sep 25, 2026.
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