EV Group
150
The EVG 150 is a fully-automated resist processing system for spin, spray, and develop processes. The EVG 150 supports wafers up to 200 mm in diameter. The EVG 150 features a modular design with up to four wet process modules and up to twenty bake/chill units.[1]
What it is
How it works
The EVG150 processes wafers through automated resist coating and related wet processing steps. The system uses a robot for wafer handling and combines process modules for coating, developing, baking, chilling, and priming.[1]
The EVG150 can perform spin coating and spray coating, and the system can also use OmniSpray ultrasonic atomization for conformal coating of high topography. The system includes encapsulated chambers, temperature control for resist and developer lines, and process control software for recipes and data analysis.[1]
Where it fits in the process flow
The EVG150 sits in the resist-processing segment of the lithography flow, where wafers receive coating, bake, chill, develop, and prime steps. The tool also supports edge bead removal and back-side rinse functions.[1]
The EVG150 is suited to high-throughput wafer preparation before lithographic exposure and to subsequent development and bake steps after coating. The system is intended for process lines that need automated handling of thick, thin, bowed, warped, fragile, or small-diameter wafers.[1]
Applications
The EVG150 is used for MEMS, image sensors, advanced packaging, RF, 5G, 3D sensing, photonics, automotive, and power electronics manufacturing. The system supports thick and thin positive and negative resists, dielectrics, colored resists, adhesives, and polyimides.[1]
The EVG150 includes spray and spin process options, OmniSpray conformal coating, and bake modules with temperatures up to 250 °C, with optional solvent bakes and high-temperature bakes up to 350 °C. The system also supports wide-viscosity dispense options and edge bead removal and back-side rinse processing.[1]
What do the numbers mean?
Vacuum & pumping4
Wafer handling2
Gas & chemistry2
- Chemistry cabinet[2]
Performance1
Dimensions & facilities1
Configuration & options14
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EVG150 up to 300 mm | — | — | Supports wafers up to 300 mm; up to 6 process modules; includes FOUP load ports; up to 20 bake/chill/vapor prime stacks; optional NanoSpray module for deep patterns. | evgroup.com[1] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- EVG610 BrochureDatasheettamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What wafer-handling capabilities are supported?
The EVG150 supports double end-effector or edge handling, and it can handle bowed, warped, thin, and fragile wafers. The system also supports thick or ultrathin wafers and small-diameter wafers.[1]
What materials can the EVG150 process?
The EVG150 supports thin and thick negative and positive resists, dielectrics, colored resists, adhesives, and polyimides.[1]
Not publicly documented
The following facts about the 150 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 150 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 150 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 150 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 150 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 150 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]evgroup.com — evgroup.comevgroup.com
- [2]Inventory photo
- [3]Inventory photo
- [4]EVG610 Brochure — aggiefab.tamu.eduaggiefab.tamu.edu
Last updated Oct 10, 2026.
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