Esec
Esec 2100 SC
The Esec 2100 SC is a die bonder platform. The Esec 2100 SC is a 3rd generation platform. The Esec 2100 SC supports wafer sizes from 4" to 12" on 8" or 12" wafer frames.[1]
Wafer size
4"
Performance
20 µm @ 3σ (15 µm option)[1]
What it is
The Esec 2100 SC is a packaging and bonding machine for die attach and strip mapping tasks in semiconductor assembly.[1]
The Esec 2100 SC belongs to the Esec 2100 platform and is part of Besi's die bonding equipment family.[1]
How it works
The Esec 2100 platform supports epoxy die attach, hot and cold processes, and real-time process monitoring through live images and status control.[1]
Where it fits in the process flow
Applications
The Esec 2100 platform is intended for epoxy die attach applications including QFN, TSOP, QFP, BGA, CSP-BGA, SiP-BGA, FBGA, and LGA.[1]
The Esec 2100 platform supports epoxy, soldering, thermo-compression, and eutectic processes.[1]
- TSOP
- FBGA
What do the numbers mean?
Wafer handling1
Performance1
Dimensions & facilities2
Configuration & options3
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What bonding method does the Esec 2100 platform use?
The Esec 2100 platform supports epoxy die attach.[1]
What wafer size range is specified for the Esec 2100 platform?
The Esec 2100 platform supports wafer sizes from 4 to 12 inches on 8-inch or 12-inch wafer frames.[1]
What placement accuracy is specified for the Esec 2100 platform?
The Esec 2100 platform specifies bonding accuracy of 20 micrometers at 3 sigma and an option for 15 micrometers.[1]
What die size range is specified for the Esec 2100 platform?
The Esec 2100 platform specifies die sizes from 0.25 millimeters with the Small Die Kit to 20 millimeters.[1]
Not publicly documented
The following facts about the Esec 2100 SC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2100 SC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Esec 2100 SC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Esec 2100 SC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2100 SC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2100 SC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
Last updated Oct 2, 2026.
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