Esec
Esec 2009 fS E
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Esec 2009 fS E is a soft solder die bonder. The Esec 2009 fS E uses point-to-line pick & place with a stationary indexer. The Esec 2009 fS E supports wafer sizes up to 8 inches.[1][2]
Wafer size
4"
Performance
± 80 µm / 0.6° (3σ)[2]
What it is
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Esec 2009 fS E fits in the die attach stage of semiconductor assembly, after wafer processing and before later packaging operations.
Applications
The Esec 2009 fS E handles soft solder die bonding applications for SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220, and DPAK devices.[1]
The Esec 2009 fS E supports single row and matrix leadframes, dual die capability, flying header fullpack use, and leadframe conversion kits.[1]
What do the numbers mean?
Wafer handling3
Performance1
Control & software1
Configuration & options5
What replaced it?
Related models
- siblingEsec Esec 2100 hS— Listed on the same product page as another Esec die bonding model.source[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of die attach method does the Esec 2009 fS E use?
What placement method does the Esec 2009 fS E use?
The Esec 2009 fS E uses a point-to-line pick and place method with a stationary indexer.[1][2]
What package families can the Esec 2009 fS E handle?
The Esec 2009 fS E handles SOT-23, SOT-223, SOT-89, TO-92, TO-126, TO-220, and DPAK devices.[1]
Not publicly documented
The following facts about the Esec 2009 fS E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Esec 2009 fS E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Esec 2009 fS E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Esec 2009 fS E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Esec 2009 fS E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Esec 2009 fS E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
- [3]besi.com — besi.combesi.com
Last updated Oct 5, 2026.
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