Esec
DB 2100 HS
The Esec DB 2100 HS is a die bonder. The Esec DB 2100 HS operates at 208-240 VAC. The Esec DB 2100 HS has a machine main breaker rating of 20 A.[1][2]
What it is
How it works
General reference — not yet source-verifiedA die bonder picks up individual semiconductor dies and places them onto a target surface for attachment in an assembly flow.
A die bonder in this class typically combines precision motion, alignment, and controlled placement so the die can be transferred accurately to the next assembly step.
Where it fits in the process flow
General reference — not yet source-verifiedThe Esec DB 2100 HS belongs in back-end semiconductor assembly rather than front-end wafer fabrication.
The machine sits after die singulation and before later packaging or interconnect steps that complete the device assembly.
Applications
What do the numbers mean?
Power & electrical3
Control & software2
Configuration & options9
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec DB 2100 HS Die Bonder | — | 2017 | — | Equipment inventory listing[5] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Finetech Lambda— Same function class: Packaging & Bonding, nullCompare in depthsource[3]
- MRSI HVM3— Same function class: Packaging & Bonding, nullCompare in depthsource[3]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the primary function of a die bonder?General reference — not yet source-verified
A die bonder picks up singulated semiconductor die from a wafer or other carrier and places them onto a package substrate, leadframe, or other mounting surface, establishing the mechanical attachment that starts the package assembly.
What bonding methods do die bonding machines typically support?General reference — not yet source-verified
Common methods include epoxy or adhesive die attach, where a dispensed material holds the die; eutectic bonding, which uses a metal alloy that melts at a specific temperature; and solder-based attach. Some systems also support ultrasonic or thermosonic techniques for flip-chip configurations.
How does vision alignment contribute to die bonding accuracy?General reference — not yet source-verified
Vision systems in die bonders use cameras to locate the die on the wafer and the target site on the substrate. By comparing positions, the machine can adjust its placement path and orientation, ensuring the die is attached with the required positional accuracy and angular alignment.
What factors affect the speed and precision of die placement?General reference — not yet source-verified
Placement speed depends on the pick-and-place mechanism, the distance between pickup and placement locations, and the number of alignment steps. Precision is influenced by the resolution of the vision system, the mechanical stiffness of the bond head, and the control loop for position correction.
What are typical maintenance concerns for die bonding systems?General reference — not yet source-verified
Maintenance focuses on keeping the pick-up tools clean and preventing contamination of dispense nozzles or bonding surfaces. Regular calibration of vision and placement coordinates, as well as monitoring of wear in moving components, are important to sustain process quality.
Not publicly documented
The following facts about the DB 2100 HS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DB 2100 HS are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DB 2100 HS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DB 2100 HS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DB 2100 HS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DB 2100 HS are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]Inventory photo
Last updated Sep 28, 2026.
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