Esec
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The Esec 3088 is equipped with dual monitors that display the software interface for operator control.[2]
A binocular microscope with adjustable focusing knobs provides visual accuracy during bonding. The work area includes clamps to hold components and is well-illuminated. The control panel features multiple buttons, a trackball mouse for navigation, and an emergency stop button. Two flow meters or pressure gauges are mounted on the front of the machine. A red light source or laser illuminates the metal surface during bonding.[2]
Wire bonding is performed after the die has been attached to the package substrate or leadframe and before the encapsulation or molding step.
The Esec 3088 is used for circuit packaging, specifically IC packaging.[3]
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The Esec 3088 is a wire bonder used for IC packaging.[1][3][2]
The machine includes dual monitors, a binocular microscope with focusing knobs, a control panel with buttons and a trackball mouse, two flow meters or pressure gauges on the front, and a red light source or laser for illumination.[2]
The following facts about the 3088 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the 3088 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3088 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3088 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3088 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3088 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Oct 2, 2026.
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