Esec
2100 FC HS
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Esec 2100 FC HS is a flip chip bonder. The Esec 2100 FC HS supports wafer sizes from 4" to 12". The Esec 2100 FC HS is specified with bonding accuracy of 8 µm @3s in High Accuracy Mode.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
What do the numbers mean?
Wafer handling2
Performance2
Dimensions & facilities3
Configuration & options8
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What package types can the Esec 2100 FC HS handle?
The Esec 2100 FC HS supports FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and CSP-LED.[1][3]
What wafer size range does the Esec 2100 FC HS support?
The Esec 2100 FC HS supports wafer sizes from four inches to twelve inches.[1][2]
What placement speed does the Esec 2100 FC HS support?
The Esec 2100 FC HS supports up to 16,000 UPH without dipping and up to 12,000 UPH with dipping.[2]
Not publicly documented
The following facts about the 2100 FC HS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC HS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2100 FC HS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2100 FC HS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 FC HS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 FC HS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [3]2100 FC hS — Besi | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [4]Equipment inventory listing
Last updated Oct 6, 2026.
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