Electroglas
The Electroglas EG 4090 is a fully automated wafer probing system designed for high-precision wafer-level electrical testing. The EG 4090 performs automated wafer loading and unloading, high-precision wafer positioning, probe-to-pad alignment, and electrical contact between probe needles and wafer pads. The EG 4090 typically supports 150 mm (6-inch) and 200 mm (8-inch) wafers.[1][2]

Plate 01eg4090 prober mark inspection
Plate 02EG4090 Probers | APEX retrofit
The Electroglas EG 4090 is an automatic wafer prober designed for wafer-level electrical testing. The EG 4090 supports 150 mm and 200 mm wafers and was offered with heated chucks, available in nickel or gold chuck material. The system is configured with a cassette loader and various handling arm options.[3][4][5][6][7][1][8][9][16]
The EG 4090 consists of several integrated subsystems: a wafer handling system that automates loading and unloading from cassettes, a chuck with temperature control for consistent thermal conditions, precision X-Y-Z and theta motion stages for wafer positioning and probe touchdown, an optical alignment system using a microscope and camera for die recognition, and control electronics including motion controllers and system software for recipe management.[1][2]
In R&D and engineering validation, the EG 4090 aids new process development, probe card evaluation, and device failure analysis. Many fabs continue to operate the EG 4090 in legacy and mature-node production lines where its stability and repeatability are sufficient.[1][2]
The EG 4090 remains widely deployed in fabs, test houses, and R&D facilities.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Thinwafer - Armsize: IH Bernoulli | — | 2003–2003 | Variant described with nickel chuck, hot chuck temp, airblower IH, thinwafer, and armsize IH Bernoulli. | Equipment inventory listing[3] |
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Airblower: IH - Armsize: IH Big | — | 2004–2004 | Variant described with nickel chuck, hot chuck temp, airblower IH, and armsize IH Big. | Equipment inventory listing[6] |
| EG 4090 Automatic Wafer Prober - Nickel Chuck - Hot Chuck Temp - Armsize: Small | — | 2004–2004 | Variant described with nickel chuck, hot chuck temp, and armsize Small. | Equipment inventory listing[7] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The EG 4090 typically supports 150 mm (6-inch) and 200 mm (8-inch) wafers.[1][2]
The EG 4090 was configured with nickel or gold chuck material and included hot chuck temperature control.[3][4][5][6][7][8][9][16]
The EG 4090 is typically integrated with parametric testers, functional test systems, and yield monitoring platforms.[1][2]
Yes, the EG 4090 includes a cassette loader for automated wafer loading and unloading.[8][9][16]
The following facts about the EG 4090 Automatic Wafer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the EG 4090 Automatic Wafer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the EG 4090 Automatic Wafer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the EG 4090 Automatic Wafer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the EG 4090 Automatic Wafer are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the EG 4090 Automatic Wafer are on record.
Answerable by: university cleanroom staff or an OEM application specialist
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Last updated Sep 11, 2026.
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