Electroglas
4090
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
How it works
A probe setup can use sensing of the support surface and the wafer surface to estimate wafer thickness before probing. The thickness estimate helps set the upward motion needed to make probe contact without excessive force on the probe tips.[4]
A probing system can also include obstruction sensing to reduce damage from particles or other high spots between the wafer and the chuck. The sensing step checks for conditions that could interfere with safe electrical testing.[4]
Where it fits in the process flow
The Electroglas 4090 fits in the wafer test stage of semiconductor manufacturing. The system is used before die are singulated and before acceptable die proceed to packaging.[4]
Applications
The Electroglas 4090 is used for electrical testing of semiconductor wafers and microfeature workpieces. The same class of equipment is used to contact die pads and verify device function at wafer level.[4]
What do the numbers mean?
Configuration & options6
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 4090+ Prober | — | — | — | Equipment inventory listing[1] |
| Electroglas 4090 with ETS 200 Tester | — | — | Configured with an ETS 200 Tester | Equipment inventory listing[2] |
| Electroglas 4090 with LTX / Credence ASL 1000 Tester | — | — | Configured with an LTX / Credence ASL 1000 Tester | Equipment inventory listing[3] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Frequently asked questions
What part of the probe sequence does wafer thickness relate to?
Wafer thickness is used to determine how far to move the wafer upward to make contact with the probe pins.[4]
What problem can interfere with probe contact during wafer testing?
Particles trapped between the wafer and the chuck can create high spots that may crush probe card pins.[4]
Not publicly documented
The following facts about the 4090 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4090 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 4090 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4090 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4090 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 4090 are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
- [3]inventory listing
- [4]US20070046311A1 - Systems and methods for sensing obstructions associated with electrical testing of microfeature workpieces - Google Patents — patents.google.compatents.google.com
- [5]Equipment inventory listing
- [6]Electroglas, Inc. products: the horizon 4090 — electroglas.com (Oct 6, 1999)web.archive.org
- [7]ELECTROGLAS INC Form 10-K (1999) — SEC EDGAR — sec.gov (Mar 12, 1999)sec.gov
Last updated Oct 8, 2026.
