Edwards
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The iGX600M can be installed on-tool, close to the process chamber, or in a remote pump area, allowing flexibility in fab layout.[3]
The Edwards iGX600M dry vacuum pump is suitable for processes including load lock, transfer, metrology, lithography, PVD (physical vapor deposition), PVD pre-clean, RTA (rapid thermal annealing), strip/ashing, oxide etch, silicon etch, metal etch, and ion implant source pumping.[1]
The iGX series pumps are available in variants and configurations to handle applications from clean processes through to medium-duty processes.[3]
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The peak pumping speed is 600 m³/h (365 cfm, 10,333 l/min).[3][1]
The ultimate pressure is 7.00×10⁻⁴ mbar (5.25×10⁻⁴ Torr, 0.07 Pa).[3][1]
Typical applications include load lock, transfer, metrology, lithography, PVD process, PVD pre-clean, RTA, strip/ashing, oxide etch, silicon etch, metal etch, and implant source pumping.[1]
The following facts about the IGX 600 M Vacuum are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IGX 600 M Vacuum are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the IGX 600 M Vacuum are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IGX 600 M Vacuum are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IGX 600 M Vacuum is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the IGX 600 M Vacuum are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Sep 27, 2026.