Disco
DFL7340
The Disco DFL7340 is a stealth dicing system for silicon wafer dicing. The Disco DFL7340 is dedicated to dicing Si wafers only. The Disco DFL7340 supports a maximum sample diameter of 200 mm.[1][2][3]
What it is
The Disco DFL7340 is a model used for silicon wafer dicing in dedicated packaging-area equipment sets.[2][3]
How it works
The Disco DFL7340 uses a stealth dicing engine with a wavelength of 1342 nm.[2]
Where it fits in the process flow
Applications
The Disco DFL7340 is dedicated to dicing Si wafers only, and the compatible wafer size is up to 200 mm in diameter.[2]
- Dicing silicon wafers
- Stealth dicing of Si substrates
What do the numbers mean?
Wafer handling9
- Street clearance requirement
- Wafer must be metal-free in a width of 0.4 × substrate thickness, centered on the dicing street[4]
Optics & imaging8
- Surface roughness requirement
- Dicing streets must be smooth (mirror polish) on the surface where the laser is incident[4]2 sources
Performance2
Configuration & options15
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What material is the Disco DFL7340 dedicated to dicing?
The Disco DFL7340 is dedicated to dicing silicon wafers only.[2]
What wafer diameter can the Disco DFL7340 handle?
The Disco DFL7340 supports wafers up to 200 mm in diameter.[2]
Does the Disco DFL7340 support backside dicing?
The Disco DFL7340 supports backside dicing through tape.[2]
Not publicly documented
The following facts about the DFL7340 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL7340 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL7340 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL7340 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL7340 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL7340 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]nanofab.ualberta.ca — nanofab.ualberta.cananofab.ualberta.ca
- [2]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
- [3]c2mi.ca — c2mi.cac2mi.ca
- [4]waferpedia.comwaferpedia.com
Last updated Oct 10, 2026.
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