Disco
DFG 8560
What it is
How it works
The DFG 8560 has three phases, an air-bearing spindle, and water-cooled external cooling.[1]
Where it fits in the process flow
General reference — not yet source-verifiedA grinder sits in the wafer back-end process flow after front-side device formation when wafer thinning or backside preparation is needed. A grinder often supports later singulation or packaging steps by bringing the wafer to a target thickness and condition.
What do the numbers mean?
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Meyer Burger DS 266— Same function class: Dicing & Grinding, nullCompare in depthsource[7]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFG 8560 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 8560 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 8560 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 8560 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 8560 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 8560 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Inventory photo
- [6]web.archive.org — disco.co.jp (Feb 22, 2020)web.archive.org
- [7]Equipment inventory listing
Last updated Oct 4, 2026.
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