Disco
The Disco DAD3241 is an automatic dicing saw. The Disco DAD3241 supports workpieces up to Φ8 inches. The Disco DAD3241 uses a high-output 1.8 kW spindle.[1][2]
The DAD3241 is positioned in dicing and grinding workflows as a precision processing tool for cutting or separating small, fragile substrates after front-end fabrication and before later assembly steps. Dicing saws use a rotating blade to make controlled cuts through wafers or similar workpieces.
The DAD3241 uses servo motors on the X, Y, and Z axes to raise axis speed and throughput. The DAD3241 uses a high-output 1.8 kW spindle and a rotation speed range of 6,000 to 60,000 min-1.[3][2][1]
The DAD3241 includes a built-in microscope, PC-based communication control, a touch-screen interface, wafer mapping, a log viewer, and a help viewer. The DAD3241 also uses a Y-axis scale as a standard feature and a Non-Contact Setup function to improve measurement accuracy and reduce measurement time.[3][2]
The DAD3241 accepts workpieces up to Φ8 inches, with a maximum cutting range of 210 mm on both the X and Y axes. The DAD3241 supports a special JIG chuck table option for square workpieces up to 8 x 8 inches.[3][2][1]
The DAD3241 is used after a workpiece has been mounted for cutting and before the separated parts are removed for later handling. The DAD3241 works with a tape applicator for bubble-free sample mounting, and the provided tape and UV curing system help ease removal of diced die from the tape.[1]
The DAD3241 is intended for difficult-to-cut materials from silicon to ceramics. The DAD3241 supports blades for silicon, glass, and sapphire samples.[1][3][2]
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No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3241 are on record.
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Last updated Oct 3, 2026.
The Disco DAD3241 is an automatic dicing saw that supports workpieces up to Φ8" and uses Disco R07 blades for glass and silicon.
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