Waferpedia

Disco

DAD3221

Dicing & Grinding150mmDisco DAD3221 family
Research Quality: 40% complete

The Disco DAD3221 is an automatic dicing saw. The Disco DAD3221 supports substrates up to 150 mm diameter. The Disco DAD3221 includes non-contact setup, a blade breakage detector, circle cut capability, CO2 injection, pattern recognition, and automatic micro-alignment.[1][2][3]

DiscoDAD3221
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Wafer size

150mm

Power

2.0 kW at 40,000 min-1[2]

Performance

Yes[1]

Optics

blade breakage detector[1]

What it is

The Disco DAD3221 is an automatic dicing saw used for separating wafer substrates into individual die.[2][4]

The DAD3221 is a single-axis dicing saw with a single spindle.[2]

How it works

The DAD3221 includes non-contact setup, blade breakage detection, circle cut functions for edge trimming or downsizing, a carbon dioxide injector to reduce particle adhesion and electrostatic discharge damage, pattern recognition, and automatic micro-alignment.[1][3][2]

The DAD3221 uses image-recognition functions such as auto alignment, auto focus, and auto kerf check, and it supports SECS or GEM communication control.[2]

Where it fits in the process flow

The DAD3221 prepares diced pieces for packaging and assembly workflows.[4]

Applications

The DAD3221 is specified for wafers up to six inches as a standard capability and for one hundred fifty millimeter by one hundred fifty millimeter workpieces with a user-specified configuration.[2][5]

What do the numbers mean?

Power & electrical2

Standard rated output
2.0 kW at 40,000 min-1[2]
Accurate?
Optional rated output
1.8 kW at 60,000 min-1[2]
Accurate?

Wafer handling3

Wafer size
100, 150 mm wafers[1]
Accurate?
Wafer / substrate size
100, 150 mm wafers[1]
Accurate?
Substrate size
up to 150mm diameter[3]
Accurate?

Optics & imaging2

Blade monitoring
blade breakage detector[1]
Accurate?
Blade breakage detector
Yes[1]
Accurate?

Performance2

Alignment aids
pattern recognition system; automatic micro-alignment[1]
Accurate?
Automatic micro-alignment
Yes[1]
Accurate?

Dimensions & facilities2

Equipment dimensions
490 × 870 × 1,670 mm[2]
Accurate?
Equipment weight
Approx. 420 kg[2]
Accurate?

Configuration & options11

Type
automatic dicing saw[1]
Accurate?
Setup
non-contact setup[1]
Accurate?
Cutting functions
circle cut for edge trimming or down sizing[1]
Accurate?
Particle/ESD mitigation
CO2 injector to prevent particle adhesion and electrostatic discharge damage[1]
Accurate?
Equipment type
Automatic dicing saw[1]
Accurate?
Max. workpiece size
Φ6 inch (150 mm × 150mm user-specified specification)[2]
Accurate?
Non-contact setup
Yes[1]
Accurate?
Circle cut
For edge trimming or downsizing[1]
Accurate?
CO2 injector
Prevents particle adhesion and electrostatic discharge damage[1]
Accurate?
Pattern recognition system
Yes[1]
Accurate?
Spindle layout
Single[2]
Accurate?
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What replaced it?

  • siblingDisco DAD321— listed on the same source page as another automatic dicing sawsource[1]

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Standard rated output2.0 kW at 40,000 min-1[2]
  • Optional rated output1.8 kW at 60,000 min-1[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What workpiece size does the DAD3221 support?

The DAD3221 processes workpieces up to six inches as a standard capability, and one hundred fifty millimeter by one hundred fifty millimeter workpieces with a user-specified configuration.[2][5]

What setup and alignment features are included?

The DAD3221 includes non-contact setup, pattern recognition, automatic micro-alignment, auto alignment, auto focus, and auto kerf check.[1][3][2]

What functions help protect the wafer during cutting?

The DAD3221 includes a blade breakage detector, a carbon dioxide injector to prevent particle adhesion and electrostatic discharge damage, and circle cut capability for edge trimming or downsizing.[1][3]

Does the DAD3221 support factory communication integration?

The DAD3221 supports SECS or GEM and supports communication control as an option.[2]

Not publicly documented

The following facts about the DAD3221 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAD3221 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the DAD3221 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the DAD3221 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the DAD3221 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the DAD3221 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]epfl.ch — epfl.chepfl.ch
  2. [2]disco.com.sg — disco.com.sgdisco.com.sg
  3. [3]epfl.ch — epfl.chepfl.ch
  4. [4]https://mmf.montana.edu/documents/equipment-operating-manuals/DISCO%20DAD3221%20Dicing%20Saw-Accessible.pdf — mmf.montana.edummf.montana.edu
  5. [5]Disco-DAD3221 | AUROTECH CORPORATION — aurotech.comaurotech.com
  6. [6]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
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Last updated Oct 9, 2026.

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