Denton Vacuum
Thermal
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Denton Thermal Evaporator is a vacuum deposition system with a diffusion pump and a roughing pump. The Denton Thermal Evaporator can be used to thermally deposit up to four metals sequentially and is equipped with sample rotation control. The Denton Thermal Evaporator has four sources: two for boats and two for wire materials.[1][2]
What it is
How it works
Where it fits in the process flow
Applications
The Denton thin-film deposition system is used for thermally depositing metals in a cleanroom nanofabrication facility.[2]
Thermal evaporators in the Physical Vapor Deposition area can deposit over forty different materials, including conductive metals, semiconductors, and dielectrics.[4]
What do the numbers mean?
Vacuum & pumping3
Wafer handling1
Optics & imaging1
Control & software1
Configuration & options2
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- Standard Operating Procedure (SOP)SOPutexas.edu
- dep-03_denton_operating_manual.pdfManualumd.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
How many metal sources does the Denton system have?
The system can deposit up to four metals sequentially and has four sources: two for boats and two for wire materials.[2]
What vacuum pump types are used on this system?
The system includes a diffusion pump and a roughing pump.[1]
What is the maximum substrate size the system accommodates?
The system handles up to one 4-inch diameter substrate.[3]
Does the system have rotation capability?
The system is equipped with sample rotation control.[2]
What types of materials are deposited in the CNS Physical Vapor Deposition area?
Over forty different materials are available, including conductive metals, semiconductors, and dielectrics.[4]
Not publicly documented
The following facts about the Thermal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Thermal are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Thermal are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Thermal are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Thermal are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Thermal is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]tmi.utexas.edu — tmi.utexas.edutmi.utexas.edu
- [3]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
- [4]Nanofabrication - Harvard CNS — cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [5]Hi-Res 100 Chromium Sputtering System — dentonvacuum.com (Mar 10, 2004)web.archive.org
Last updated Sep 24, 2026.
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